PROBLEM TO BE SOLVED: To provide a method for manufacturing a device by using a liquid epoxy resin composition having both of a function as an under-filling and a function as a seal for a cap.;SOLUTION: In the liquid epoxy resin composition for sealing the semiconductor containing (A) a liquid epoxy resin and (B) an aromatic amine type hardener in a blending mol ratio of [(A) a liquid epoxy resin/(B) an aromatic amine type hardener] of at least 0.7 and not more than 1.2, and (C) a globular silica powder with a mean particle diameter of 1 to 5 μm in 50-75 mass% to the total weight of (A) to (C) components, by allowing it to stand at an atmosphere of 20 to 40°C, a product, obtained by the reaction of the (A) and the (B), having a molecular weight in a range of 400 to 600 is controlled to be contained in 4-8% in an organic component.;COPYRIGHT: (C)2009,JPO&INPIT
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