DEFECT DETECTING METHOD FOR MULTILAYER ELECTRONIC COMPONENT, AND METHOD OF MANUFACTURING MULTILAYER ELECTRONIC COMPONENT

摘要

PPROBLEM TO BE SOLVED: To provide a defect detecting method for a multilayer electronic component, which is useful to improve manufacturing processes and can improve the development speed of the multilayer electronic component which is made more compact, thinner, and more multilayered, and to provide a method of manufacturing the multilayer electronic component using the same. PSOLUTION: The defect detecting method of the multilayer electronic component includes the steps of: providing a mark M on an external layer surface or in the external layer of a green stack 4a to be cut so that it corresponds to a green chip 4b having been cut; cutting the green stack 4a to obtain a plurality of green chips 4b; and inspecting the green chips 4b and specifying a defect occurrence position of the green stack 4a from a mark M of a defective green chip 4b. PCOPYRIGHT: (C)2009,JPO&INPIT