首页> 外国专利> METHOD FOR MANUFACTURING AN OXIDE THIN FILM TRANSISTOR USING A DRY ETCHING PROCESS, CAPABLE OF MINIMIZE THE DEGRADATION OF A THIN CONDUCTIVE FILM

METHOD FOR MANUFACTURING AN OXIDE THIN FILM TRANSISTOR USING A DRY ETCHING PROCESS, CAPABLE OF MINIMIZE THE DEGRADATION OF A THIN CONDUCTIVE FILM

机译:使用干蚀刻工艺制造氧化薄膜晶体管的方法,该工艺能够使导电薄膜的降解最小化

摘要

PURPOSE: A method for manufacturing an oxide thin film transistor using a dry etching process is provided to prevent the degradation of and an IGZO oxide semiconductor thin film by forming a protecting layer.;CONSTITUTION: In a method for manufacturing an oxide thin film transistor using a dry etching process is comprised of the steps: forming a first thin conductive film(203) functioned as a source and a drain electrode at an upper part of a substrate(201); forming an IGZO oxide semiconductor thin film(205) on the first thin conductive films; performing the IGZO oxide semiconductor thin film through a dry etching firstly; performing the IGZO oxide semiconductor thin film through dry etching secondly; forming an insulator film functioned as the gate insulating layer(207) on the IGZO oxide semiconductor thin film; and forming a second thin conductive film(209) functioned as the gate electrode on oxide insulator thin film.;COPYRIGHT KIPO 2010
机译:目的:提供一种利用干蚀刻工艺制造氧化物薄膜晶体管的方法,以通过形成保护层来防止IGZO氧化物半导体薄膜的降解。干蚀刻工艺包括以下步骤:在基板(201)的上部形成用作源极和漏极的第一导电薄膜(203);在第一导电薄膜上形成IGZO氧化物半导体薄膜(205);首先通过干蚀刻进行IGZO氧化物半导体薄膜;其次通过干法刻蚀形成IGZO氧化物半导体薄膜;在IGZO氧化物半导体薄膜上形成用作栅绝缘层(207)的绝缘膜;并在氧化物绝缘体薄膜上形成用作栅电极的第二导电薄膜(209)。;COPYRIGHT KIPO 2010

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