首页> 外国专利> METHOD FOR FORMING ZINC OXIDE THIN FILM, ZINC OXIDE THIN FILM PROVIDED BY THE SAME, SEMICONDUCTOR ELEMENT USING THE ZINC OXIDE THIN FILM, AND DEVICE FOR FORMING THE ZIND OXIDE THIN FILM

METHOD FOR FORMING ZINC OXIDE THIN FILM, ZINC OXIDE THIN FILM PROVIDED BY THE SAME, SEMICONDUCTOR ELEMENT USING THE ZINC OXIDE THIN FILM, AND DEVICE FOR FORMING THE ZIND OXIDE THIN FILM

机译:形成氧化锌薄膜的方法,由氧化锌薄膜提供的氧化锌薄膜,使用氧化锌薄膜的半导体元件以及形成氧化锌薄膜的装置

摘要

PROBLEM TO BE SOLVED: To provide: a method for forming a zinc oxide thin film capable of providing a zinc oxide thin film having a crystallite size equal to or larger than that in the case where a bias is not applied even when an oxygen flow rate is increased by including oxygen in a sputtering gas; a zinc oxide thin film provided by the same; a semiconductor element using the zinc oxide thin film; and a device for forming the zinc oxide thin film.;SOLUTION: In this method for forming the zinc oxide thin film, the zinc oxide thin film is formed on a substrate by carrying out sputtering by using a zinc oxide target in an atmosphere containing the sputtering gas comprising oxygen and an inactive gas, and the thin film is formed while applying a pulse bias to the substrate.;COPYRIGHT: (C)2010,JPO&INPIT
机译:解决的问题:提供一种形成氧化锌薄膜的方法,该方法能够提供微晶尺寸等于或大于即使在氧气流量不施加偏压的情况下的微晶尺寸的氧化锌薄膜。通过在溅射气体中包含氧气来增加由其提供的氧化锌薄膜;使用氧化锌薄膜的半导体元件;解决方案:在该形成氧化锌薄膜的方法中,通过在含有氧化锌靶的气氛中通过使用氧化锌靶进行溅射,在基板上形成氧化锌薄膜。包含氧气和惰性气体的溅射气体,并在向基板施加脉冲偏压的同时形成薄膜。;版权所有:(C)2010,JPO&INPIT

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