In the inspection manner of bonding state for the semiconductor equipment where the bonding dot which joints the inspection manner

摘要

PROBLEM TO BE SOLVED: To check precisely a bonding condition of bonding points aligned in several rows without being disturbed by bonding wires of other bonding points. SOLUTION: A method comprises the following steps of: taking and storing an image of each part of bonding points composing bonding point rows before bonding; connecting a bonding wire to the each bonding point in bonding point rows after storing the above image; taking and storing an image of each part of bonding points in bonding point rows after bonding; extracting the only image of the bonding wire connected to each part of bonding points of bonding point rows by working out difference of the above stored images for each part of the bonding points before and after bonding; and checking whether the bonding condition of the each bonding point is good or not, from the extracted image of the bonding wire. The above each step is iterated for every row in sequence from the outer bonding point row to the inner bonding point row of the plural bonding point rows.