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Gallium nitride-based semiconductor stacked structure, method for fabrication thereof, gallium nitride-based semiconductor device and lamp using the device
Gallium nitride-based semiconductor stacked structure, method for fabrication thereof, gallium nitride-based semiconductor device and lamp using the device
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机译:氮化镓基半导体堆叠结构,其制造方法,氮化镓基半导体器件和使用该器件的灯
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摘要
A gallium nitride-based semiconductor stacked structure includes a single crystal substrate, a low-temperature buffer layer grown at a low temperature in a region contiguous to the single crystal substrate and a gallium nitride-based semiconductor layer overlying the low-temperature buffer layer. The low-temperature buffer layer possesses therein a single crystal layer formed of a hexagonal AlXGaγN-based Group III nitride material containing gallium predominantly over aluminum, wherein 0.5γ≦1 and X+γ=1. The single crystal layer has crystal defects at a smaller density on a (10-10) crystal face than on a (11-20) crystal face. A method for production of the gallium nitride-based semiconductor stacked structure is also disclosed.
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机译:氮化镓基半导体堆叠结构包括:单晶基板;在与单晶基板相邻的区域中在低温下生长的低温缓冲层;以及覆盖在低温缓冲层上的氮化镓基半导体层。低温缓冲层在其中具有由六方晶的Al X Sub> Ga γ Sub> N基的III族氮化物材料形成的单晶层,该III族氮化物材料主要在铝上包含镓,其中0.5 < γ≤1且X +γ= 1。单晶层在(10-10)晶面上具有比在(11-20)晶面上更小的密度的晶体缺陷。还公开了一种用于生产氮化镓基半导体堆叠结构的方法。
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