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METHOD OF AND APPARATUS FOR LASER DRILLING HOLES WITH IMPROVED TAPER
METHOD OF AND APPARATUS FOR LASER DRILLING HOLES WITH IMPROVED TAPER
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机译:锥度提高的激光钻孔的方法和装置
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摘要
It is a kind of to drill out with the blind hole that taper may be selected, allow to be formed the electrical connection between each layer in fo multi-layer electronic circuit, while maintaining quality and yield. This method is depended in the base diameter for recognizing through-hole top end diameter Yu the through-hole, limits taper, two independent equations of function. These non trivial solutions of simultaneous solution generate a kind of optimization for making treating capacity, while maintaining selected taper and quality, have identical pulse parameter using interim unmodified Q-switched pulse carbon dioxide laser. Real-time pulse design is not required in that; Therefore, system complexity and cost can reduce.
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