METHOD FOR LED CHIP ATTACHMENT ON A SUBSTRATE IMPROVING THERMAL RESISTANCE, CAPABLE OF REDUCING A DEVIATION OF THERMAL RESISTANCE FOR AN LED

摘要

PURPOSE: A method for LED chip attachment on a substrate improving thermal resistance is provided to improve the lifetime and the reliability of the LED by reducing a thermal resistance and preventing the degradation and the thermal runaway of an LED package.;CONSTITUTION: A metallic package body(310) is composed with a structure including a constant area and depth in order to receive an LED chip(311). A part for receiving the LED chip(313) is a metal with an excellent thermal property, especially copper or aluminum. A liquid silver epoxy(312) with excellent thermal conductivity is used in order to bond the LED chip on the part for receiving the LED chip. The LED chip is hardened in a high temperature chamber at 150°C for 2 hours, after bonding with the silver epoxy. A radiation wavelength of the LED chip ranges 200nm to 1000nm.;COPYRIGHT KIPO 2010