LED MODULE USING AN ALUMINUM SUBSTRATE WITH HIGH THERMAL CONDUCTIVITY AS A LOWER METAL SUBSTRATE AND A MANUFACTURING METHOD THEREOF

摘要

PURPOSE: An LED module using a metal substrate and a manufacturing method thereof are provided to efficiently discharge heat emitted from an LED device.;CONSTITUTION: A plurality of electrode layers are comprised of an insulation layer and an upper metal substrate and are repeatedly formed on a lower metal substrate. A mounting groove(140) is formed by partially etching an electrode layer to expose the surface of a lower metal substrate(100) for mounting a plurality of LEDs. The plurality of LEDs are mounted on the mounting groove. The LEDs are wire-bonded with each upper metal substrate of the electrode layer.;COPYRIGHT KIPO 2011