首页>
外国专利>
Loading mechanism for a socket with contact grid arrangement (lga - land grid array) for mobile platforms
Loading mechanism for a socket with contact grid arrangement (lga - land grid array) for mobile platforms
展开▼
机译:用于移动平台的带有接触栅格装置(lga-接地栅格阵列)的插座的加载机制
展开▼
页面导航
摘要
著录项
相似文献
摘要
Techniques for a land grid array (LGA) socket loading mechanism for mobile platforms are described. An apparatus includes a LGA socket mounted to a printed circuit board, and an LGA package seated in the LGA socket. The LGA package includes an LGA package substrate and a semiconductor die mounted on the LGA package substrate, and a heat pipe attached to the semiconductor die, wherein the heat pipe is to apply a compressive load to the semiconductor die. The heat pipe includes at least two leaf springs to apply a compressive load to the LGA package substrate. Other embodiments are described and claimed.
展开▼