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LIGHT-EMITTING DEVICE, MANUFACTURING METHOD OF LIGHT EMITTING DEVICE, AND MONOLITHIC LIGHT-EMITTING DIODE ARRAY

机译:发光装置,发光装置的制造方法以及单体发光二极管阵列

摘要

PROBLEM TO BE SOLVED: To facilitate providing a varied wiring coupling structure in a monolithic LED array.SOLUTION: A light-emitting device 10 comprises: a light-emitting laminate 11, which includes a first and second conductive semiconductor layers 11a and 11b and an active layer 11c, and has a first and second plane formed by the first and second conductive semiconductor layers 11a and 11b, respectively; a first contact 18, which is formed on the first plane so as to be connected with the first conductive semiconductor layer 11a; a second contact 13, which is formed on the second plane so as to be connected with the second conductive semiconductor layer 11b; a first insulation layer 12a, which is formed on the second plane and a side face of the light-emitting laminate 11 excluding a region where the second contact 13 is formed; a conductive layer 14, which is coupled to the second contact 13 and extended along the side face of the light-emitting laminate 11, in which a portion adjacent to the first plane is exposed to an identical direction to the first plane; and a substrate structure 17, which is formed so as to surround the side face and the second plane of the light-emitting laminate.
机译:解决的问题:为了促进在单片LED阵列中提供变化的布线耦合结构。解决方案:发光器件10包括:发光层压体11,其包括第一和第二导电半导体层11a和11b以及有源层11c具有分别由第一和第二导电半导体层11a和11b形成的第一和第二平面。第一接触18,其形成在第一平面上以与第一导电半导体层11a连接;在第二平面上形成并与第二导电半导体层11b连接的第二接触13。第一绝缘层12a,其形成在除了形成第二接触部13的区域以外的发光层压体11的第二平面和侧面上;导电层14,其连接至第二接触件13并沿发光层压板11的侧面延伸,其中与第一平面相邻的部分沿与第一平面相同的方向暴露。基板结构17形成为包围发光层叠体的侧面和第二平面。

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