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LEADFRAME, METHOD OF MANUFACTURING THE LEADFRAME, AND SEMICONDUCTOR LIGHT EMITTING DEVICE USING THE LEADFRAME

机译:铅框架,制造该铅框架的方法以及使用该铅框架的半导体发光装置

摘要

PROBLEM TO BE SOLVED: To manufacture a lead frame at low cost, having a light-reflecting ring that reflects light from a light-emitting element.;SOLUTION: The leadframe is manufactured which include a leadframe formed of a plurality of structures, such that a top-side upper structure and a back-side lower structure are integrated and are separated from each other, and a filling resin which surrounds the lead frame and is as thick as the lead frame, wherein the upper structure has a pad portion 2 and a lead portion 2a, and the lower structure has a heat-dissipating portion 3, integrated with the pad portion 2 and a heat dissipation portion 3a integrated with the lead portion 2a. The leadframe has a stepped portion or tapered portion, spreading from the top side to the reverse side of the lead frame, at a side face portion of the upper structure, and also has a stepped portion or tapered portion, spreading from the reverse side to the top side of the lead frame, on a side surface portion of the lower structure, the light-reflecting ring 4a, having an inclined inner peripheral surface facing the pad portion and formed integrally with the filling resin being provided outside the pad portion 2 and lead portion 2a.;COPYRIGHT: (C)2011,JPO&INPIT
机译:解决的问题:为了以低成本制造具有反射来自发光元件的光的光反射环的引线框架。解决方案:制造的引线框架包括由多种结构形成的引线框架,使得顶侧上部结构和背侧下部结构被整合并且彼此分离,并且填充树脂围绕引线框架并且与引线框架一样厚,其中上部结构具有焊盘部分2和下部结构具有与焊盘部2一体的散热部3和与引线部2a一体的散热部3a。引线框架在上部结构的侧面部分处具有从引线框架的顶侧向背面扩展的阶梯部分或锥形部分,并且还具有从反面扩展至壳体的阶梯部分或锥形部分。在下部结构的侧面部分上的引线框架的顶侧上,光反射环4a具有面对焊盘部分的倾斜的内周表面,并且与填充树脂一体地形成在焊盘部分2的外部,并且导引部分2a .;版权:(C)2011,日本特许厅和INPIT

著录项

  • 公开/公告号JP2010272565A

    专利类型

  • 公开/公告日2010-12-02

    原文格式PDF

  • 申请/专利权人 TOPPAN PRINTING CO LTD;

    申请/专利号JP20090120675

  • 申请日2009-05-19

  • 分类号H01L33/62;H01L23/50;H01L23/29;H01L23/31;

  • 国家 JP

  • 入库时间 2022-08-21 18:21:24

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