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Laser double-sided groove processing apparatus and double-sided groove processing method

机译:激光双面槽加工装置及双面槽加工方法

摘要

PPROBLEM TO BE SOLVED: To provide a double side grooving device and a double side grooving method using a laser beam by which double-side grooves which are small in the variation of groove properties on both sides are formed without especially increasing the cost of equipment. PSOLUTION: This device is a double-side grooving device by which a groove on both sides of a material to be worked is formed by projecting a laser light 2 to the material to be worked which is relatively moved and which has a laser beam head 16 which is arranged so as to irradiate the surface of the material to be worked with a laser light excited with an oscillator 14, a first nozzle 1 which is arranged so as to jet a first assisting gas 3 from the side of the surface of the material to be worked to a molten part by laser beam irradiation, a second nozzle 4 which is arranged so as to jet the second assisting gas 5 from the side of the rear surface of the material to be worked to the molten part by the laser beam irradiation, a first pressure control means 18a for adjusting the pressure of the first assisting gas and a second pressure control means 18b for adjusting the pressure of the second assisting gas. PCOPYRIGHT: (C)2007,JPO&INPIT
机译:

要解决的问题:提供一种使用激光束的双面切槽装置和双面切槽方法,通过该双面切槽装置和双面切槽方法,在不特别增加成本的情况下形成两侧的槽特性的变化小的双面槽。设备。

解决方案:该设备是一种双面开槽设备,通过将相对于具有激光的激光2投射到待加工的材料上,在待加工材料的两侧形成凹槽。光束头16被布置成用由振荡器14激发的激光照射待加工材料的表面,第一喷嘴1被布置成从表面一侧喷射第一辅助气体3。在通过激光束将要加工的材料加工到熔融部件上的过程中,第二喷嘴4布置成将第二辅助气体5从加工后的材料的后表面侧喷射到熔融材料上。激光束照射,用于调节第一辅助气体的压力的第一压力控制装置18a和用于调节第二辅助气体的压力的第二压力控制装置18b。

版权:(C)2007,日本特许厅&INPIT

著录项

  • 公开/公告号JP4775699B2

    专利类型

  • 公开/公告日2011-09-21

    原文格式PDF

  • 申请/专利权人 日立金属株式会社;

    申请/专利号JP20050255762

  • 发明设计人 落合 正典;佐々木 淳;

    申请日2005-09-02

  • 分类号B23K26/14;B23K26/38;

  • 国家 JP

  • 入库时间 2022-08-21 18:20:36

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