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The mannered, mannered, and forms the surface implemental die/di package mannered form the portable die electronic product null die/di which forms the flip chip die/di
The mannered, mannered, and forms the surface implemental die/di package mannered form the portable die electronic product null die/di which forms the flip chip die/di
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机译:领会,领会并形成表面实施裸片/ di封装,其形式为便携式裸片电子产品空裸片/ di,其形成倒装芯片裸片/ di
A method for forming a high voltage component package, which includes providing a flexible non-conductive substrate, forming a conductive layer on the substrate, and forming a circuit trace from the conductive layer, the circuit trace having frangible leads. A first side of a component overlies at least a portion of the circuit trace, and the component is coupled to the circuit trace by breaking a frangible lead on the trace and bonding the lead to the component. The flexible substrate is then bent or folded such that another portion of the circuit trace is in proximity to a second side of the component. The trace is coupled to the second side of the component either with a conductive adhesive or by bonding with another frangible trace.
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