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Electrode structures for use in integrated circuits, memory cells, a memory device, a memory system, the semiconductor die and electronic systems, as well as methods of forming them

机译:用于集成电路,存储单元,存储设备,存储系统,半导体管芯和电子系统中的电极结构及其形成方法

摘要

The electrode structure includes a dielectric layer formed of a first layer of conductive material on a surface of the first layer. Are formed in the dielectric layer, the opening exposes a portion of the surface of the first layer. Formed a dielectric layer above the portion on the exposed surface of the first layer, the second layer of conductive material, the bonding layer is formed on the bond layer. Well, the second layer, the binding layer is a diffusible material in the conductive oxide may be an oxide. This electrode structure can be annealed, it is chemically adsorbed to the bonding layer of the conductive material from the second layer to improve the adhesion of the second interlayer and the first. Programmable cell can be formed by forming a doped glass layer in the electrode structure.
机译:电极结构包括由在第一层的表面上的第一导电材料层形成的介电层。在电介质层中形成的开口暴露出第一层表面的一部分。在第一层,第二层导电材料的暴露表面上的部分上方形成介电层,在结合层上形成结合层。好吧,第二层,粘结层是可扩散材料,在导电氧化物中可以是氧化物。可以对该电极结构进行退火,将其从第二层化学吸附到导电材料的粘结层上,以改善第二中间层和第一中间层的粘附性。可以通过在电极结构中形成掺杂的玻璃层来形成可编程单元。

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