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Method for connecting wound coil and IC chip for non-contact ID identification device

机译:非接触式身份识别装置的绕线线圈与ic芯片的连接方法

摘要

PROBLEM TO BE SOLVED: To obtain a variance-free excellent junction result with higher strength with low applied pressure and small pressure area (junction area) at lower heating temperature.SOLUTION: A winding type coil is made of a copper wire having an insulating film 1a around a copper core wire 1b. A lead part 1 thereof is placed on a gold film 3a as an outermost layer of a connection terminal 3 of an IC chip 2 in a state orthogonal to two parallel sides thereof, heating and pressurizing means 5 is brought into contact with the lead part 1 from above in a state orthogonal thereto to start applying pressure, and then, while a current is supplied to generate heat, the pressure is further applied. The winding type coil has a wire diameter of 70 m±3 m (insulating film 1a: polyurethane coating), the IC chip 2 is 1000 m square, and the connection terminal 3 is in a square shape of 100 m. Further, the gold film 3a is 18 m thick, the heating and pressurizing means 5 is made of tungsten, and a contact surface 4 has long sides of 250 m in length and short sides of 70 m in width, a welding voltage is 1.8 V, a power supply time is 0.3 seconds after 0.1 seconds after the start of pressure application, the applied pressure is 80 g, and a pressure application time is 0.8 seconds.
机译:解决的问题:在较低的加热温度下,以较低的施加压力和较小的压力区域(结区域)获得高强度,高强度的无变化优异结结果。解决方案:绕组型线圈由具有绝缘膜的铜线制成1a围绕铜芯线1b。将其引线部分1以正交于其两个平行侧的状态放置在作为IC芯片2的连接端子3的最外层的金膜3a上,使加热加压装置5与该引线部分1接触。在与之正交的状态下从上方开始施加压力,然后,在供应电流以产生热量的同时,进一步施加压力。卷绕型线圈的线径为70m±3m(绝缘膜1a:聚氨酯涂层),IC芯片2为1000m见方,连接端子3为100m见方。另外,金膜3a为18m厚,加热加压机构5为钨,接触面4的长边为250m,短边为70m,焊接电压为1.8V。在开始施加压力后0.1秒后,电源时间为0.3秒,施加压力为80g,并且施加时间为0.8秒。

著录项

  • 公开/公告号JP4676573B1

    专利类型

  • 公开/公告日2011-04-27

    原文格式PDF

  • 申请/专利权人 スターエンジニアリング株式会社;

    申请/专利号JP20100188863

  • 发明设计人 星 哲哉;佐川 学;

    申请日2010-08-25

  • 分类号G06K19/077;G06K19/07;B42D15/10;

  • 国家 JP

  • 入库时间 2022-08-21 18:17:20

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