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Inorganic anion exchanger composed of bismuth compound and resin composition for electronic component encapsulation using the same
Inorganic anion exchanger composed of bismuth compound and resin composition for electronic component encapsulation using the same
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机译:由铋化合物组成的无机阴离子交换剂和使用该无机阴离子交换剂进行电子元件封装的树脂组合物
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摘要
A bismuth compound, useful as an inorganic anion exchanger used for an encapsulating material for, e.g., semiconductors, has a peak intensity of 900 to 2000 cps at 2θ=27.9° to 28.1° and a peak intensity of 100 to 800 cps at 2θ=8.45° to 8.55° in a powder X-ray diffraction pattern, and is represented by the following formula (1):Bi(OH)x(NO3)y.nH2O (1)wherein x is a positive number not less than 2.5 and less than 3, y is a positive number not more than 0.5, x+y=3, and n is 0 or a positive number.
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机译:用作用于例如半导体的封装材料的无机阴离子交换剂的铋化合物在2θ= 27.9°至28.1°时具有900至2000 cps的峰值强度,在2θ=处具有100至800 cps的峰值强度粉末X射线衍射图中为8.45°至8.55°,由下式(1)表示:<?in-line-formulae description =“在线表达式” end =“ lead”?> Bi(OH) x Sub>(NO 3 Sub>) y < /Sub>.nH2O(1)<?in-line-formulae description =“ In-line Formulae” end =“ tail”?>其中x是不小于2.5且小于3的正数,y是不大于0.5的正数,x + y = 3,并且n是0或正数。
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