Process for manufacturing printed circuit boards based materials with high thermal conduction suitable for the insertion of non-surface components.

摘要

Process for manufacturing printed circuit boards with high base materials suitable for insertion of non-surface thermal conductivity components.; The method comprises as essential steps of the invention punching a metal plate (1) for holes (2) numerically and positionally suitable for the insertion of non-surface components; the arrangement of the metallic base plate (1) on a template suction (3) provided with suction orifices (4) arranged in correspondence with the holes (2); lowering the injection head (5) of a conventional printing machine on the metal base (1) and injecting an insulating resin (7) through injection holes (6) plate, while the air holes is evacuated (2) through the suction holes (4); and punching the assembly thus obtained to obtain a die insert (12) of smaller diameter than the corresponding bore (2), initial,.