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WEAK SPOT MANAGEMENT METHOD FOR THE SEMICONDUCTOR DEVICE FABRICATION EFFECTING AN INSPECTION OF EVIDENCE THE FIRST WEAK POINT AND THE SECOND WEAK POINT
WEAK SPOT MANAGEMENT METHOD FOR THE SEMICONDUCTOR DEVICE FABRICATION EFFECTING AN INSPECTION OF EVIDENCE THE FIRST WEAK POINT AND THE SECOND WEAK POINT
PURPOSE: After the second model base verification is proceed about the mask lay out in which the weak spot management method for the semiconductor device fabrication is closely revised the light and the second weak point in which the process margin is vulnerable is extracted, the second weak point is back fed in the optical proximity correction and the mask lay out corrected the light nearing is varied.;CONSTITUTION: The mask lay out is designed from design data(S10). The first model base verification is proceed about the mask lay out and the first weak point weaking the process margin off-flavor is extracted(S11). The first weak point is back fed in the mask lay out and the mask lay out is varied(S12).;COPYRIGHT KIPO 2011
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