首页> 外国专利> BIDIRECTIONAL LIGHT EMITTING DIODE PACKAGE AND A MANUFACTURING THE SAME, CAPABLE OF INCREASING LIGHT EFFICIENCY AND IMPLEMENTING CUBIC EFFECT

BIDIRECTIONAL LIGHT EMITTING DIODE PACKAGE AND A MANUFACTURING THE SAME, CAPABLE OF INCREASING LIGHT EFFICIENCY AND IMPLEMENTING CUBIC EFFECT

机译:双向发光二极管封装及其制造方法,能够提高发光效率并实现立体效果

摘要

PURPOSE: A bidirectional light emitting diode package and a manufacturing the same are provided to implement 3D illumination by packing a conventional unidirectional light emitting device into bidirectional light emitting device.;CONSTITUTION: In a bidirectional light emitting diode package and a manufacturing the same, a first LED chip(60a) is formed on one side of an anode frame(20a) and a cathode frame(20b). The second LED chip(60b) is formed in the upper part of the other side of the anode frame and the cathode frame. A wire(102) electrically interlinks the anode frame and cathode frame through first and the second LED chips. A molding unit(15) is formed in order to fill the first LED chip, the second LED chip, a wire connection unit. . A light transmission part fills the outside of the molding.;COPYRIGHT KIPO 2012
机译:目的:提供一种双向发光二极管封装及其制造,以通过将常规的单向发光器件封装到双向发光器件中来实现3D照明。;构成:在双向发光二极管封装及其制造中,在阳极框架(20a)和阴极框架(20b)的一侧上形成第一LED芯片(60a)。第二LED芯片(60b)形成在阳极框架和阴极框架的另一侧的上部。导线(102)通过第一和第二LED芯片电互连阳极框架和阴极框架。形成模制单元(15)以填充第一LED芯片,第二LED芯片,电线连接单元。 。透光部分填充到成型件的外部。; COPYRIGHT KIPO 2012

著录项

  • 公开/公告号KR20110109385A

    专利类型

  • 公开/公告日2011-10-06

    原文格式PDF

  • 申请/专利权人 LG INNOTEK CO. LTD.;

    申请/专利号KR20100029085

  • 发明设计人 PAIK JEE HEUM;

    申请日2010-03-31

  • 分类号H01L33/62;

  • 国家 KR

  • 入库时间 2022-08-21 17:50:59

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