Method for cutting block shaped substrate into multiple thin lamellas, involves separating lamellas within range of lower surface of substrate in each case

摘要

The method involves separating lamellas within a range of a lower surface of a substrate (8) in each case. The lamella is led-out downward by the substrate under appropriate expansion of a cutting gap. The substrate is supported parallel to a cutting plane. An independent claim is also included for a device for cutting a block shaped substrate into multiple thin lamellas.