首页> 外国专利> Method for measuring e.g. filling degree of mono-crystalline silicon wafer that is utilized in photovoltaic system, involves determining uniformity of facets from normalized difference of reflectance using predefined formula

Method for measuring e.g. filling degree of mono-crystalline silicon wafer that is utilized in photovoltaic system, involves determining uniformity of facets from normalized difference of reflectance using predefined formula

机译:测量方法例如光伏系统中使用的单晶硅晶片的填充度,涉及使用预定义公式根据反射率的归一化差确定小面的均匀性

摘要

The method involves illuminating pyramid facets such that incident light is reflected directly. The reflected light from the facets is received using detectors to generate intensity signals. Reflected light from a wafer base surface is received using the detectors. Filling degree and formation of surface texture are determined from ratio of intensities, and uniformity of the facets are determined from difference and/or normalized difference of facet reflectance using predefined formula, where functions in the formula expresses proportional dependence. An independent claim is also included for an arrangement for measuring filling degree and formation of surface texture of an alkaline corroded wafer.
机译:该方法涉及照亮金字塔的小面,以便直接反射入射光。使用检测器接收来自小平面的反射光以生成强度信号。使用检测器接收来自晶片基面的反射光。根据强度比确定填充度和表面纹理的形成,并使用预定公式根据刻面反射率的差异和/或归一化差异确定刻面的均匀性,其中公式中的函数表示比例依赖性。还包括用于测量碱性腐蚀晶片的填充度和表面纹理形成的装置的独立权利要求。

著录项

  • 公开/公告号DE102010011056A1

    专利类型

  • 公开/公告日2011-09-15

    原文格式PDF

  • 申请/专利权人 BISCHOFF JOERG;

    申请/专利号DE20101011056

  • 发明设计人 BISCHOFF JOERG;

    申请日2010-03-11

  • 分类号G01N21/55;G01N21/95;

  • 国家 DE

  • 入库时间 2022-08-21 17:47:23

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