Brief description of embodiments of a component microelectronics not plane

摘要

This process for the production of a microelectronic component is not plane, concave and in particular, comprises: (▪ to superimpose a layer incorporating an active circuit flexible in - the top of a cavity formed according to the desired profile of said component, said cavity being formed in a substrate; ▪ to apply a pressure differential on either side of said layer inducing the sagging of the flexible circuit in the cavity, and therefore its conformation with that - ci . The superposition of the flexible circuit and of the cavity is made: ▪ by filling the cavity by means of a material able to be selectively removed with respect to the substrate and the flexible circuit; ▪ then, by bonding or the formation of the flexible circuit in the cavity thus filled; ▪ then, by the formation of at least one passage for access to the cavity is filled; ▪ by selective etching of the material filling the cavity via at least one passage in order to remove said material.