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Sense element for measuring magnetic field e.g. Hall sensor, has stamper whose side surfaces and specific portions are formed with higher conductivity than conductivity of inner portion of stamper
Sense element for measuring magnetic field e.g. Hall sensor, has stamper whose side surfaces and specific portions are formed with higher conductivity than conductivity of inner portion of stamper
The sense element has a wafer structure (12) that is formed by sequentially stacking semiconductor layer (15), insulation layer (14) and semiconductor substrate (13). The insulation layer is plated through stamper (16) whose side surfaces (19) are parallel to the semiconductor substrate. The side surfaces and portions (28-30) of the stamper are formed with higher conductivity than conductivity of inner portion of the stamper. Independent claims are included for the following: (1) magnetic field sensor; and (2) manufacturing method of sense element.
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