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Method and system for innovative substrate/package design for a high performance integrated circuit chipset
Method and system for innovative substrate/package design for a high performance integrated circuit chipset
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机译:用于高性能集成电路芯片组的创新衬底/封装设计的方法和系统
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摘要
Provided is a method and system for designing an integrated circuit (IC) substrate, the substrate being formed to include at least one die. The method includes providing at least portions of IC power and a grounding function on a metal 2 substrate layer and utilizing all of a metal 3 substrate layer for the grounding function. Portions of the metal 2 layer and a metal 4 layer are utilized for the IC power, wherein all of the IC power is centralized underneath the die.
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