HEAT-CURABLE SILICONE RESIN COMPOSITION FOR OPTICAL-SEMICONDUCTOR ENCAPSULATION AND OPTICAL-SEMICONDUCTOR PACKAGE FORMED USING SAME

摘要

The present invention provides: a heat-curable silicone resin composition for optical-semiconductor encapsulation which comprises (A) 100 parts by weight of an organopolysiloxane resin, (B) 10-500 parts by weight of an alkoxysilane oligomer having silicon-bonded alkoxy groups in an amount of 5-50 wt.%, (C) 10-200 parts by weight of a diorganopolysiloxane in which both ends of the molecular chain each have been blocked with a silanol group and/or an alkoxysiloxy group and which has a viscosity at 25ºC of 5-10,000 mPa·s, and (D) a zinc compound; and an optical-semiconductor package formed using the composition. This composition becomes a cured object which has excellent long-term reliability at high temperatures and which has an adequate hardness.