GLUE FILLING METHOD AND DEVICE IN THE SEMICONDUCTOR PACKAGE

摘要

Glue (4) filling method and device in the semiconductor package is provided. The glue (4) is coated to one edge or four edges of semiconductor or chips on the substrate, the glue (4) is flowing between the chip and the substrate until the space is full filled. Several edges of device are coated glue (4) and the device is moved to the vacuum box, the glue (4) is batch flowing in the several devices so that the time of filling glue (4) is decreased and the production efficiency is increased. The glue (4) is solidified in the vacuum box and the air bubbles cancel during formed glue (4) time and the cavities cancel due to the gas volatilize during glue (4) solidified. The quality and the reliability of device glue (4) filling is increased.