METHOD FOR MANUFACTURING A COOLING MODULE ASSEMBLY WHICH IS EXTENDED WITH A HEAT DISSIPATION UNIT AFTER FORMING A PENETRATION HOLE ON A CIRCUIT BOARD

摘要

PURPOSE: A method for manufacturing a cooling module assembly is provided to improve cooling efficiency by uniting the contact surface of a heat dissipation unit to a circuit board and to reduce manufacturing costs of the cooling module assembly.;CONSTITUTION: A first side(12) and a second side(13) are included in both sides of a circuit board(1). The first side is combined with the contact surface of a heat dissipation unit. The heat dissipation unit is manufactured using a metal material. The heat dissipation unit comprises a plurality of pins. A penetration hole(11) is formed by extending the second side from the first side of the circuit board. A plurality of screw holes is formed in the heat dissipation unit in order to unite the heat dissipation unit and the circuit board.;COPYRIGHT KIPO 2012