CIRCUIT FOR GENERATING A BUFFER ENABLE SIGNAL CAPABLE OF INCLUDING A MODE SIGNAL GENERATING UNIT AND A MULTI-CHIP PACKAGE

摘要

PURPOSE: A circuit for generating a buffer enable signal and a multi-chip package is provided to reduce package yield loss by changing a defective semiconductor chip into a SDP(Single Die Package) semiconductor chip package.;CONSTITUTION: A mode signal generating unit(10) includes a fuse. The mode signal generating unit generates a mode signal. The cutting state of the fuse is determined according to the defect of a semiconductor chip. A transferring unit(12) transfers a first buffer enable signal to a second buffer enable signal. The mode signal generating unit generates a mode signal by cutting the fuse.;COPYRIGHT KIPO 2012