首页> 外国专利> NITRIDE EPITAXIAL WAFER FOR A LIGHT EMITTING DEVICE, A MANUFACTURING METHOD THEREOF, AND A METHOD FOR MANUFACTURING NITRIDE LIGHT EMITTING DEVICE USING THE SAME CAPABLE OF IMPROVING CRYSTAL QUALITY AND LIGHT EXTRACTION EFFICIENCY

NITRIDE EPITAXIAL WAFER FOR A LIGHT EMITTING DEVICE, A MANUFACTURING METHOD THEREOF, AND A METHOD FOR MANUFACTURING NITRIDE LIGHT EMITTING DEVICE USING THE SAME CAPABLE OF IMPROVING CRYSTAL QUALITY AND LIGHT EXTRACTION EFFICIENCY

机译:用于发光器件的氮化物外延晶片,其制造方法以及利用能够提高晶体质量和光提取效率的能力来制造氮化物发光器件的方法

摘要

PURPOSE: A nitride epitaxial wafer for a light emitting device, a manufacturing method thereof, and a method for manufacturing a nitride light emitting device are provided to efficiently discharge heat by forming an uneven part on a substrate.;CONSTITUTION: A nitride epitaxial layer(30) is formed on a silicon wafer(10) and includes a first conductive nitride semiconductor layer(32), an active layer(35), and a second conductive nitride semiconductor layer(37). The nitride epitaxial layer includes an inner region(30A) and an edge region(30B). The crack distribution density of the inner region is larger than the crack distribution density of the edge region. The edge region of the nitride epitaxial layer is removed.;COPYRIGHT KIPO 2012
机译:目的:提供一种用于发光器件的氮化物外延晶片,其制造方法以及一种用于制造氮化物发光器件的方法,以通过在基板上形成不平坦部分来有效地散热。;构成:氮化物外延层( 30)形成在硅晶片(10)上,并且包括第一导电氮化物半导体层(32),有源层(35)和第二导电氮化物半导体层(37)。氮化物外延层包括内部区域(30A)和边缘区域(30B)。内部区域的裂纹分布密度大于边缘区域的裂纹分布密度。去除氮化物外延层的边缘区域。; COPYRIGHT KIPO 2012

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