首页> 外国专利> LIGHT EMITTING DIODE AND LIGHT EMITTING DIODE PACKAGE INCLUDING A CURRENT BLOCKING LAYER CAPABLE OF IMPROVING RELIABILITY AND DURABILITY OF A CHIP

LIGHT EMITTING DIODE AND LIGHT EMITTING DIODE PACKAGE INCLUDING A CURRENT BLOCKING LAYER CAPABLE OF IMPROVING RELIABILITY AND DURABILITY OF A CHIP

机译:发光二极管和发光二极管封装,包括能够提高芯片可靠性和耐用性的电流阻挡层

摘要

PURPOSE: A light emitting diode and a light emitting diode package including a current blocking layer are provided to prevent concentration of current by evenly distributing current through a crescent or half ring shaped current blocking layer around an electrode.;CONSTITUTION: A light emitting structure includes a first conductive semiconductor layer, an active layer and a second conductive semiconductor layer. A first electrode(21) is electrically connected to the first conductive semiconductor layer. A second electrode(22) is electrically connected to the second conductive semiconductor layer. A current blocking layer(31,32) is formed to surround the first electrode and the second electrode. A transparent electrode layer(14) is formed between the first conductive semiconductor layer and the first electrode.;COPYRIGHT KIPO 2012
机译:目的:提供一种发光二极管和包括电流阻挡层的发光二极管封装,以通过在电极周围通过月牙形或半环形电流阻挡层均匀地分布电流来防止电流集中。组成:发光结构包括第一导电半导体层,有源层和第二导电半导体层。第一电极(21)电连接到第一导电半导体层。第二电极(22)电连接到第二导电半导体层。形成电流阻挡层(31,32)以包围第一电极和第二电极。在第一导电半导体层和第一电极之间形成透明电极层(14)。; COPYRIGHT KIPO 2012

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