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MANUFACTURING METHOD OF ULTRA-LOW DIELECTRIC MEMBRANE CONTAINING NANO PORES, HAVING EXCELLENT MECHANICAL STRENGTH AND LOW DIELECTRIC CONSTANT
MANUFACTURING METHOD OF ULTRA-LOW DIELECTRIC MEMBRANE CONTAINING NANO PORES, HAVING EXCELLENT MECHANICAL STRENGTH AND LOW DIELECTRIC CONSTANT
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机译:具有优异的机械强度和低介电常数的包含纳米孔的超低介电膜的制造方法
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摘要
PURPOSE: A manufacturing method of ultra-low dielectric membrane is provided to impart mechanical strength required for low dielectric membrane, and to provide extremely low dielectric constant, and to be used as an inter-layer insulative film for a semiconductor.;CONSTITUTION: A manufacturing method of ultra-low dielectric membrane is manufactured by heat curing using an organic or inorganic matrix, and a reactive pore-former. The ultra-low dielectric membrane is manufactured by irradiation with UV rays of 200-300 nm at 400-450 °C for 5-30 minutes conducted with the heat curing at the same time. The matrix consists of 10-90 vol% of polymethylsilsesquioxane precursor or a copolymer thereof, and 10-90 vol% of a pore forming template in chemical formula 1: R1OCH2[CH(OR2)]nCH2OR3. In chemical formula 1, R1, R2, and R3 is respectively hydrogen, or A. A is R4Si(OR5)3, R4 and R5 is respectively a C1-5 alkyl group, and n is an integer from 2-4.;COPYRIGHT KIPO 2012
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