The present invention relates to a process for the cleavage of a substrate (1) in order to detach a layer (1 ′), comprising the following successive steps: (i) the formation of a structure (2), called the generatrix of the stresses, to locally of the surface of the substrate (1), adapted to expand or contract in a plane parallel to the surface of the substrate (1) under the effect of a heat treatment, (ii) the application to said structure of a suitable heat treatment so as to cause expansion or contraction of the said structure (2), so as to generate in the substrate (1) a plurality of local stresses, the combination of which generates a force greater than the mechanical strength of the substrate in a cleavage plane (c) parallel to the substrate surface defining the layer (1 ′) to detach, said stress leading to the cleavage of the substrate (1) according to the plane (c.).
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