首页> 外国专利> FUNCTIONAL LIQUID PATTERN FORMATION METHOD, CONDUCTIVE PATTERN FORMATION METHOD, FUNCTIONAL LIQUID PATTERN FORMATION SYSTEM, CONDUCTIVE PATTERN FORMATION SYSTEM, METHOD FOR MANUFACTURING FUNCTIONAL LIQUID PATTERN STRUCTURE AND METHOD FOR MANUFACTURING CONDUCTIVE PATTERN STRUCTURE

FUNCTIONAL LIQUID PATTERN FORMATION METHOD, CONDUCTIVE PATTERN FORMATION METHOD, FUNCTIONAL LIQUID PATTERN FORMATION SYSTEM, CONDUCTIVE PATTERN FORMATION SYSTEM, METHOD FOR MANUFACTURING FUNCTIONAL LIQUID PATTERN STRUCTURE AND METHOD FOR MANUFACTURING CONDUCTIVE PATTERN STRUCTURE

机译:功能性液体图案形成方法,导电性图案形成方法,功能性液体图案形成系统,导电性图案形成系统,制造功能性液体图案结构的方法以及制造导电性图案结构的方法

摘要

PROBLEM TO BE SOLVED: To provide a functional liquid pattern formation method/system and a conductive pattern formation method/system, along with a method for manufacturing a functional liquid pattern structure and a method for manufacturing a conductive pattern structure, capable of avoiding occurrence of a bulge, a jaggy and the like and preferably forming a fine pattern.;SOLUTION: A base material is heated and maintained at a surface temperature of 45°C or more (preferably 60°C or more). A pattern of a catalyst carrying polymer liquid for plating is formed by discharging the catalyst carrying polymer liquid for plating containing a catalyst carrying polymer for plating, a high boiling point solvent and a low boiling point solvent on the base material by an ink jet system, on the basis of the discharge condition that a diameter D1 of a discharge liquid drop, a pitch W between dots of the catalyst carrying polymer liquid for plating and a diameter D2 of the dot of the liquid satisfy the relation of D1WD2. A conductive pattern consisting of a plating film is formed by adding a plating catalyst (or plating catalyst precursor) after curing the liquid and performing plating treatment.;COPYRIGHT: (C)2013,JPO&INPIT
机译:解决的问题:提供一种功能性液体图案形成方法/系统和导电图案形成方法/系统,以及用于制造功能性液体图案结构的方法和用于制造导电图案结构的方法,能够避免发生解决方案:将基材加热并保持在45°C或更高(最好是60°C或更高)的表面温度。通过喷墨系统将包含用于电镀的催化剂的聚合物液体,包含高沸点溶剂和低沸点溶剂的用于电镀的催化剂的聚合物液体喷出在基材上,从而形成用于电镀的催化剂的聚合物液体的图案,基于排出液滴的直径D1的排出条件,镀敷用催化剂载持聚合物液体的点之间的间距W与液体的点的直径D2满足D 1 < / Sub> 2 。通过在固化液体并进行电镀处理后添加电镀催化剂(或电镀催化剂前体)来形成由电镀膜组成的导电图案。; COPYRIGHT:(C)2013,JPO&INPIT

著录项

  • 公开/公告号JP2013008851A

    专利类型

  • 公开/公告日2013-01-10

    原文格式PDF

  • 申请/专利权人 FUJIFILM CORP;

    申请/专利号JP20110140729

  • 发明设计人 KATSUMURA MANABU;

    申请日2011-06-24

  • 分类号H05K3/38;H05K3/10;H05K3/18;

  • 国家 JP

  • 入库时间 2022-08-21 16:57:44

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