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Methods for Treating Surfaces, Methods for Removing One or More Materials from Surfaces, and Apparatuses for Treating Surfaces

机译:表面处理方法,从表面去除一种或多种材料的方法以及表面处理设备

摘要

Some embodiments include utilization of both plasma and aerosol to treat substrate surfaces. The plasma and aerosol may be utilized simultaneously, or sequentially. In some embodiments, the plasma forms a plasma sheath over the substrate surfaces, with the plasma sheath having an electric field gradient therein. The aerosol comprises liquid particles charged to a polarity, and such polarity is transferred to contaminants on the substrate surfaces through interaction with the aerosol. The polarity may be used to assist in dislodging the contaminants from the substrate surfaces. The electric field of the plasma sheath may then sweep the contaminants away from the substrate surfaces. In some embodiments, multiple different aerosols are formed to remove multiple different types of materials from substrate surfaces. Some embodiments include apparatuses configured for treating substrate surfaces with both plasma and aerosol.
机译:一些实施例包括利用等离子体和气雾剂两者来处理衬底表面。血浆和气雾剂可以同时使用,也可以依次使用。在一些实施例中,等离子体在衬底表面上方形成等离子体鞘,其中等离子体鞘在其中具有电场梯度。气雾剂包括带电成极性的液体颗粒,并且这种极性通过与气雾剂的相互作用转移到基底表面上的污染物上。极性可用于帮助从基板表面清除污染物。然后,等离子体鞘的电场可以将污染物扫离基底表面。在一些实施例中,形成多种不同的气雾剂以从基底表面去除多种不同类型的材料。一些实施例包括被配置为用等离子体和气雾剂处理衬底表面的设备。

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