PRINTED CIRCUIT BOARD WITH ANTI-STATIC PROTECTION STRUCTURE

摘要

A printed circuit board includes a first conductive metal layer, a ground layer and a first insulating layer arranged between the first conductive metal layer and the ground layer. A through-hole runs through the first conductive metal layer, the first insulating layer and the ground layer. The through-hole is configured for an insertion of a ground pin of an electronic component. A second insulation layer is formed on an inside wall of the first conductive metal layer in the through-hole, thereby the ground pin inserted in the through-hole being insulated from the first conductive metal layer. A second conductive metal layer is formed on an inside wall of the ground layer and an inside wall of the first insulating layer in the through-hole, to electrically connect the ground pin to the ground layer, to provide a ground path for the electronic component.