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Suspension having bonding pads with solder layers, manufacturing method of a suspension, and connecting method between a suspension and a slider
Suspension having bonding pads with solder layers, manufacturing method of a suspension, and connecting method between a suspension and a slider
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机译:具有带有焊料层的接合垫的悬架,悬架的制造方法以及悬架和滑块之间的连接方法
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摘要
A suspension includes a flexure and a plurality of electrical traces formed on the flexure. Each electrical trace has a trace body and a bonding pad arranged for connecting with a slider, and the bonding pad is a free end before connecting with the slider and is capable of bending to the trace body flexibly, and the bonding pad includes a trace body layer and a solder layer formed on the trace body layer, thereby the bonding pads of the electrical traces connecting with the slider by reflowing the solder layer. The present invention uses no extra solder balls, so as to reduce the manufacturing cost and the corresponding apparatus cost. The invention also discloses a manufacturing method of a suspension, and a connecting method for a suspension and a slider.
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