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A METHOD OF FORMING A FLEXIBLE CHIP STACKED CHIP ASSEMBLY AND A FLEXIBLE CHIP STACKED CHIP ASSEMBLY THEREOF
A METHOD OF FORMING A FLEXIBLE CHIP STACKED CHIP ASSEMBLY AND A FLEXIBLE CHIP STACKED CHIP ASSEMBLY THEREOF
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机译:一种形成柔性芯片堆叠芯片组件的方法及其柔性芯片堆叠芯片组件
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摘要
A three-dimensional package consisting of a plurality of folded integrated circuit chips (100, 110, 120) is described wherein at least one chip provides interconnect pathways for electrical connection to additional chips of the stack, and at least one chip (130) is provided with additional interconnect wiring to a substrate (500), package or printed circuit board. Further described, is a method of providing a flexible arrangement of interconnected chips that are folded over into a three-dimensional arrangements to consume less aerial space when mounted on a substrate, second-level package or printed circuit board.
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