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Method for manufacturing a monocrystalline nanowire

机译:用于制造单晶纳米线的方法

摘要

A method for manufacturing a single crystal nano-structure includes providing a device layer with a 100 structure on a substrate; providing a stress layer onto the device layer; patterning the stress layer along the 110 direction of the device layer; selectively removing parts of the stress layer to obtain exposed parts of the device layer; plane dependent etching of the exposed parts of the device layer to obtain an exposed 111 faces of the device layer; thermally oxidizing the exposed 111 face of the device layer and forming a lateral oxidation layer at an interface of the device layer and the stress layer; providing a mask layer onto the oxidized exposed 111 face of the device layer; removing remaining parts of the stress layer to obtain further exposed parts of the device layer; removing the mask layer; plane dependent etching of the further exposed parts of the device layer to form a single crystal nano-structure with a triangular shaped cross section, until a side of the triangular shaped cross section coplanar to a side of a cross section of the oxidized exposed 111 face is small in comparison with the side of the cross section of the oxidized exposed 111 face.
机译:一种用于制造单晶纳米结构的方法,包括:在基板上提供具有100结构的器件层;以及在器件层上形成具有100结构的器件层。在器件层上提供应力层;沿器件层的110方向构图应力层;选择性地去除应力层的一部分以获得器件层的暴露部分;对器件层的暴露部分进行与平面有关的蚀刻以获得器件层的暴露的111面;热氧化器件层的暴露的111面,并在器件层与应力层的界面处形成横向氧化层。在器件层的氧化的暴露的111面上提供掩模层;去除应力层的剩余部分以获得器件层的进一步暴露的部分;去除掩模层;器件层的其他暴露部分的与平面有关的蚀刻,以形成具有三角形横截面的单晶纳米结构,直到该三角形横截面的一侧与被氧化暴露的111面的横截面的一侧共面与氧化的暴露的111面的横截面的侧面相比小。

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