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Modular wafering concept for wafering plant
Modular wafering concept for wafering plant
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机译:切片设备的模块化切片概念
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摘要
A wire saw device (100) for sawing a plurality of slices of a workpiece (10) is described. The wire saw device includes a wire guide assembly with at least two wire guide cylinders (122) for guiding a wire (20) to form at least one wire web with at least one working area, wherein the at least two wire guide cylinders (122) have a rotation axis, a first compartment (102), which houses the wire guide assembly and has a first side portion of the compartment, which is essentially parallel to the rotation axis, wherein the first compartment further comprises a second side portion of the compartment, which opposes the first side portion and which is essentially parallel to the rotation axis, a second compartment (104) housing a spool (116) for providing new wire, wherein the second compartment (104) is adjacent the first side portion.
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