首页> 外国专利> PHENYL GROUP-CONTAINING ORGANIC/INORGANIC HYBRID PREPOLYMER, HEAT RESISITANT ORGANIC/INORGANIC HYBRID MATERIAL, AND ELEMENT ENCAPSULATION STRUCTURE

PHENYL GROUP-CONTAINING ORGANIC/INORGANIC HYBRID PREPOLYMER, HEAT RESISITANT ORGANIC/INORGANIC HYBRID MATERIAL, AND ELEMENT ENCAPSULATION STRUCTURE

机译:含苯基的有机/无机杂化预聚物,耐热性有机/无机杂化材料和元素包封结构

摘要

The object of the present invention is to provide an organic-inorganic hybrid material having heat resistance, and said object of the present invention can be attained by providing an organic-inorganic hybrid prepolymer containing a phenyl group which is prepared by the polycondensation reaction accompanying dehydration between a polydimethylsiloxane and a metal and/or semimetal alkoxide, wherein (a) phenyl group(s) is (are) partially or wholly introduced into said polydimethylsiloxane and/or said metal and/or semimetal alkoxide.
机译:本发明的目的是提供一种具有耐热性的有机-无机杂化材料,并且本发明的所述目的可以通过提供一种含有苯基的有机-无机杂化预聚物来实现,该预聚物是通过伴随脱水的缩聚反应制备的。在一个聚二甲基硅氧烷和一种金属和/或半金属醇盐之间,其中一个或多个苯基被部分或全部引入到所述聚二甲基硅氧烷和/或所述金属和/或半金属醇盐中。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号