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Coating method for depositing a coating system on a substrate and substrate with a coating system

机译:用于在基材上沉积涂料体系的涂布方法以及具有该涂料体系的基材

摘要

Coating method for depositing a layer system formed from hard material layers, on a substrate, comprises (a) providing an evacuatable process chamber (2) comprising a cathodic vacuum arc evaporation source (Q1) having an evaporation material (M1), and a magnetron discharge source (Q2) having a discharge material (M2), (b) depositing at least one contact layer comprising the evaporation material, on the surface of substrate, (c) depositing at least one intermediate layer in the form of e.g. a nanostructured mixed layer, and (d) depositing at least one outer layer comprising discharge material. Coating method for depositing a layer system formed from hard material layers, on a substrate, comprises (a) providing an evacuatable process chamber (2) comprising a cathodic vacuum arc evaporation source (Q1) having an evaporation material (M1), and a magnetron discharge source (Q2) having a discharge material (M2), which is operated in a high power impulse magnetron sputtering mode, (b) depositing at least one contact layer comprising the evaporation material, on the surface of the substrate in a cathodic vacuum arc evaporation method only using the cathodic vacuum arc evaporation source, (c) depositing at least one intermediate layer in the form of a nanostructured mixed layer, preferably a nano-layered intermediate layer in a hybrid phase or as a nanocomposite layer comprising the evaporation material and the discharge material, by parallel operation of the cathodic vacuum arc evaporation source and the magnetron discharge source, and (d) depositing at least one outer layer comprising the discharge material only using the magnetron discharge source. An independent claim is also included for a substrate comprising a layer system formed by the above coating method, where the contact layer exhibits a thickness of 0-50000 nm, the intermediate layer exhibits a thickness of 50-10000 nm, and the outer layer exhibits a thickness of 10-10000 nm.
机译:用于在基板上沉积由硬质材料层形成的层系统的涂覆方法,包括:(a)提供可抽空的处理室(2),该处理室包括具有蒸发材料(M1)的阴极真空电弧蒸发源(Q1)和磁控管具有放电材料(M2)的放电源(Q2),(b)在衬底表面上沉积至少一层包括蒸发材料的接触层,(c)以例如以下形式沉积至少一层中间层:纳米结构混合层,和(d)沉积至少一个包含放电材料的外层。用于在基板上沉积由硬质材料层形成的层系统的涂覆方法,包括:(a)提供可抽空的处理室(2),该处理室包括具有蒸发材料(M1)的阴极真空电弧蒸发源(Q1)和磁控管具有放电材料(M2)的放电源(Q2),其以高功率脉冲磁控溅射模式操作,(b)以阴极真空电弧在基板表面上沉积至少一层包含蒸发材料的接触层仅使用阴极真空电弧蒸发源的蒸发方法,(c)沉积至少一个中间层,该中间层为纳米结构混合层的形式,优选为处于混合相的纳米层中间层或包含蒸发材料的纳米复合层,以及通过阴极真空电弧蒸发源和磁控管放电源的并联运行,排出材料,以及(d)沉积至少一层外层复合材料仅使用磁控管放电源对放电材料进行唱唱。对于包括通过上述涂覆方法形成的层系统的基板,还包括独立权利要求,其中接触层的厚度为0-50000 nm,中间层的厚度为50-10000 nm,外层的厚度为50-10000 nm。厚度为10-10000 nm。

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