THERMOSETTING RESIN COMPOSITION CAPABLE OF PROVIDING A DRY FILM WHICH CAN PREVENT DEFECTS OF APPEARANCE WHEN USED FOR A SOLDER RESIST, A DRY FILM, AND A PRINTED CIRCUIT BOARD USING THE SAME

摘要

PURPOSE: A thermosetting resin composition is provided to have good properties which are suitable for laser processing and excellent sealability as a solder resist composition.;CONSTITUTION: A thermosetting resin composition comprises an epoxy resin, a coloring agent, and a curing agent. The colorant has a peak of absorbance within the range of one side or both sides of the wavelengths of 350-550 nm or 570-700 nm. A dry film comprises a dried film of the thermosetting resin composition on a carrier film. The printed circuit board comprises a cured layer formed on a substrate in which circuit pattern is formed by using the dry film.;COPYRIGHT KIPO 2013;[Reference numerals] (AA) Spectrum difference of copper before and after oxidation; (BB) Wavelength[nm]