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LEADFRAME, METHOD FOR MANUFACTURING THE LEADFRAME, AND SEMICONDUCTOR LIGHT EMITTING DEVICE USING THE LEADFRAME

机译:铅框架,制造铅的方法以及使用该铅框架的半导体发光装置

摘要

Lead frame, LED LED chip 1 to a plurality of places pad having a surface (A) for the portion to the chip mounting (2) and a lead having the LED chip and performing the electrical connection electrically connecting the area (C) part ( and a 2a) on the same plane. And the area S1 of the mounting surface for the pad portion, a heat radiating If (B) the relationship between the area S2 0 S1 S2 for facing and for the mounting surface. Lead frame, the pad portion side in between the back for the mounting surface and the heat radiation for, the step-like portion for holding the filling resin at the time of expanding toward the back for heat radiation from for the mounting surface, the mold or It has a tapered section (E). ;
机译:引线框,LED LED芯片1到多个放置焊盘,该多个放置焊盘具有用于芯片安装座(2)的部分的表面(A),以及具有LED芯片并进行电连接以将区域(C)部分电连接的引线(和2a)在同一平面上。并且,焊盘部的安装面的面积S1为散热面If(B),对置面和安装面的面积S2 0 <S1 <S2之间的关系。引线框,安装面的背面与散热之间的焊盘部侧,从安装面向散热的背面向后方扩展时用于保持填充树脂的阶梯状部,模具或具有锥形截面(E)。 ;

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