LEADFRAME, METHOD FOR MANUFACTURING THE LEADFRAME, AND SEMICONDUCTOR LIGHT EMITTING DEVICE USING THE LEADFRAME

摘要

Lead frame, LED LED chip 1 to a plurality of places pad having a surface (A) for the portion to the chip mounting (2) and a lead having the LED chip and performing the electrical connection electrically connecting the area (C) part ( and a 2a) on the same plane. And the area S1 of the mounting surface for the pad portion, a heat radiating If (B) the relationship between the area S2 0 S1 S2 for facing and for the mounting surface. Lead frame, the pad portion side in between the back for the mounting surface and the heat radiation for, the step-like portion for holding the filling resin at the time of expanding toward the back for heat radiation from for the mounting surface, the mold or It has a tapered section (E). ;