Method for applying epoxy adhesive on substrate during mounting e.g. octagonal semiconductor chips, involves delivering adhesive portions, where nozzle height above location during delivery step is temporary larger than at beginning of step

摘要

The method involves positioning a dispensing nozzle (3) in a preset height (z1) above a location of a substrate (1). Adhesive portions (4.1-4.n) are delivered on the substrate location by the dispensing nozzle. The height of the dispensing nozzle above the substrate location during the delivery step is temporary larger than at beginning of the delivery step. The height of the nozzle above the substrate location is increased continuously or in discrete steps during delivery. A needle tip is moved towards a container with an adhesive for receiving the adhesive by immersion in the container.