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A temperature-compensated structure with power amplifier for the temperature compensator

机译:具有用于温度补偿器的功率放大器的温度补偿结构

摘要

A temperature-compensated structure (20) with:a temperature compensator witha temperature compensation bellows (32), of the length l of reacts to temperature changes, anda temperature compensation actuator (37), which in response to the length of the temperature compensation bellows (32) moves;a movable structure (38); anda mechanical force amplifier (48), which extends between the temperature compensation actuator (37) and the movable structure (38), a to the movable structure (38) is greater than the force exerted by the temperature compensation bellows (32) is the force generated, wherein the temperature compensation actuator (37), and the movable structure (38) are biased relative to each other, and wherein the power amplifier (48)a first inclined ramp (50) on the temperature compensation actuator (37),a second inclined ramp (52) on the movable structure (38), anda roller element (54), wherein the roller element the first inclined ramp (50) and the second inclined ramp (52) make contact in such a way that a movement of the temperature compensation actuator (37) a movement of the movable structure (38) is generated.
机译:一种温度补偿结构(20),其具有:具有温度补偿波纹管(32)的温度补偿器,其长度为1的l对温度变化作出反应;以及温度补偿致​​动器(37),其响应于温度补偿波纹管的长度(32)移动;可移动结构(38);在温度补偿致​​动器(37)和可移动结构(38)之间延伸的机械力放大器(48),对可移动结构(38)的作用力大于温度补偿波纹管(32)施加的力。产生力,其中温度补偿致​​动器(37)和可移动结构(38)彼此相对偏置,并且功率放大器(48)以及温度补偿致​​动器(37)上的第一倾斜斜坡(50),可移动结构(38)上的第二倾斜斜面(52)和滚子元件(54),其中第一倾斜斜面(50)和第二倾斜斜面(52)的滚子元件以移动的方式接触温度补偿致​​动器(37)的运动产生可移动结构(38)的运动。

著录项

  • 公开/公告号DE102006038682B4

    专利类型

  • 公开/公告日2013-09-05

    原文格式PDF

  • 申请/专利权人 RAYTHEON COMPANY;

    申请/专利号DE20061038682

  • 发明设计人 GABOR DEVENYI;

    申请日2006-08-17

  • 分类号G02B7/00;G02B7/02;

  • 国家 DE

  • 入库时间 2022-08-21 16:22:41

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