POLISHING DEVICE, METHOD OF POLISHING GLASS SUBSTRATE, METHOD OF MANUFACTURING GLASS SUBSTRATE, AND METHOD OF MANUFACTURING GLASS SUBSTRATE FOR MAGNETIC RECORDING MEDIUM

摘要

PROBLEM TO BE SOLVED: To reduce a plate thickness deviation of a glass substrate in a polishing process.;SOLUTION: A polishing device 200 includes a base 220, an upper surface plate 201, a lower surface plate 202 and an elevating mechanism 208. The elevating mechanism 208 includes a cylinder device 209 for elevation elevating the upper surface plate 201. In a piston rod 210 of the cylinder device 209 for elevation, the lower end is connected to a suspension mechanism 207 supporting the upper surface plate 201 via a universal joint 250. The suspension mechanism 207 includes a support post 207a extended downward and a support base 207b fixed to an upper surface of the upper surface plate 201. A plurality of surface plate displacement regulation mechanisms 270 are provided in the vicinity of an outer periphery of the support base 207b. Each of the surface plate displacement regulation mechanisms 270 includes horizontal force absorption means 280 which supports mass of the upper surface plate 201 and is elastically deformed to absorb force of a horizontal direction (X and Y directions) when horizontal force is applied to the upper surface plate 201 during a polishing process, for instance.;COPYRIGHT: (C)2014,JPO&INPIT