The addition hardening die silicone resin constituent and light-emitting diode null for the light-emitting diode

摘要

PPROBLEM TO BE SOLVED: To provide an addition-curable silicone resin composition for LED, having high resistance relative to thermal shock and hardly generating a crack even under a severe temperature cycle. PSOLUTION: The organo-polysiloxane composition includes at least (A) 100 pts.mass of organo-polysiloxane not containing a hydrogen atom bonded to a silicon atom in one molecule, having at least two alkenyl groups in one molecule and represented by the following average composition formula (1): RSBa/SBSiOSB(4-a)/2/SB(1), (B) organo hydrogen polysiloxane having at least two hydrogen atoms bonded to a silicon atoms and at least one alkenyl group bonded to the silicon atom in one molecule and represented by the following average composition formula (2): RSP1/SPSBb/SBHSBc/SBSiOSB(4-b-c)/2/SB, and (C) a catalytic amount of an addition reaction catalyst. The addition-curable silicone resin composition for the light-emitting diode is characterized in that the organo hydrogen polysiloxane (B) is formulated such that the number of the hydrogen atoms bonded to the silicon atom becomes 0.4-10 number per total number of one of the alkenyl group bonded to the silicon atom in the components (A) and (B). PCOPYRIGHT: (C)2011,JPO&INPIT