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COBALT BASE FILM-FORMING METHOD, COBALT BASE FILM-FORMING MATERIAL, AND NOVEL COMPOUND

机译:钴基成膜方法,钴基成膜材料和新型化合物

摘要

A present invention provide a technique for easily forming a high-quality cobalt base film, which have a small specific resistance. The present invention comprises a transportation process of a Co[i-C3H7NC(C2H5)N-i-C3H7]2, and a film formation process by decomposition of the Co[i-C3H7NC(C2H5)N-i-C3H7]2. The film formation process comprises at least a first film formation process and a second film formation process. In the first film formation process, a film formation chamber is supplied with at least NH3 and/or NH3 product compound, and is not virtually supplied with H2. In the second film formation process, the film formation chamber is supplied with at least NH3 and/or NH3 product compound, and H2. An internal pressure of the film formation chamber in the first film formation process is higher than an internal pressure of the film formation chamber in the second film formation process.
机译:本发明提供了一种容易形成具有低电阻率的高质量钴基膜的技术。本发明包括Co [i-C3H7NC(C2H5)N-i-C3H7] 2的传输过程,以及通过Co [i-C3H7NC(C2H5)N-i-C3H7] 2的分解形成膜的过程。成膜过程至少包括第一成膜过程和第二成膜过程。在第一成膜过程中,至少向成膜室供应NH 3和/或NH 3产物化合物,而实际上不供应H 2。在第二成膜过程中,在成膜室中至少供给NH 3和/或NH 3产物化合物以及H 2。第一成膜工序中的成膜室的内部压力高于第二成膜工序中的成膜室的内部压力。

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