首页> 外国专利> Method and apparatus of core timing prediction of core logic in the chip-level implementation process through an over-core window on a chip-level routing layer

Method and apparatus of core timing prediction of core logic in the chip-level implementation process through an over-core window on a chip-level routing layer

机译:通过芯片级路由层上的超核窗口在芯片级实施过程中对核心逻辑进行核心时序预测的方法和装置

摘要

A method and/or an apparatus of core timing prediction is disclosed. In one embodiment, a method may include generating a core timing model of a core logic that is accurately transferable to any chip-level integration process. The method may reduce performance degradation and/or performance variation of the core logic caused by a number of interactions between core logic components and chip-level components in the chip-level integration process. In addition, the core timing model of the core logic may be generated by filling un-wired tracks with metal in any of an outermost layer of the core logic after a core logic routing and constructing a layer at least an area of and adjacent to any of the outermost layer of the core logic with grounded metal that is orthogonal to those of the metal used in the outermost layer of the core logic.
机译:公开了核心定时预测的方法和/或设备。在一个实施例中,一种方法可以包括生成可被准确地转移到任何芯片级集成过程的核心逻辑的核心时序模型。该方法可以减少由芯片级集成过程中的核心逻辑组件和芯片级组件之间的多次交互引起的核心逻辑的性能下降和/或性能变化。另外,可以通过在核心逻辑布线之后在核心逻辑的最外层中的任何一层中的金属中填充金属的未布线的轨迹并构造至少一个与任何一个区域相邻的层来生成核心逻辑的核心时序模型。核心逻辑最外层的接地金属与接地逻辑垂直,该接地金属与核心逻辑最外层中使用的金属正交。

著录项

  • 公开/公告号US8775995B2

    专利类型

  • 公开/公告日2014-07-08

    原文格式PDF

  • 申请/专利权人 LSI CORPORATION;

    申请/专利号US201213657000

  • 发明设计人 RUBEN SALVADOR MOLINA;ALEXANDER TETELBAUM;

    申请日2012-10-22

  • 分类号G06F17/50;

  • 国家 US

  • 入库时间 2022-08-21 16:00:16

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